QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Company Profile

Quik-Pak

Quik-Pak, a division of Promex, provides IC packaging, assembly, and wafer preparation services in its ISO 9001:2008 and ITAR-registered facility in San Diego, California. Quik-Pak manufactures overmolded QFN/DFN packages and pre-molded air cavity QFN packages that provide a fast, convenient solution for prototype to full-production needs. Same-day assembly services are provided to shorten time to market. Quik-Pak also provides high-volume IC assembly services utilizing its automated assembly and molding equipment for production runs in the 10,000s of units. In addition to wire bond assembly, the company assembles flip chips, BGAs, stacked die, sensors, MEMS, chip-on-board (COB) and chip-on-flex assemblies.

www.icproto.com


Promex specializes in design, packaging and heterogeneous assembly of complex medical and biotech devices for a variety of applications, including microelectronic subassemblies; Class II & III implantables and wearables; custom sensors and transducers; microfluidic, ultrasound and disposable devices; high-resolution imaging arrays; and camera and diagnostic equipment. Located in Silicon Valley since 1975, the company provides design-for-manufacturing services coupled with materials science expertise and broad assembly capabilities for small- to mid-volume onshore production. Services include RoHS-optimized SMT, wafer thinning, dicing, wirebond, flip chip, overmolding and Class 100/Class 1000 cleanrooms. Promex is ISO 13485:2016 and ISO 9001:2015 certified, IPC certified and ITAR registered.

www.promex-ind.com

ITAR Registered ISO 9001