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Open Cavity Plastic PackageBGA Balling
QUIK-PAK NEWS
Technical Article: Gaining Time and Creativity without Compromise
Quik-Pak Announces Copper Wire Bonding Capability
Quik-Pak Expands New Open-Molded Plastic Package (OmPP)™ Product family
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Open-molded Plastic Packages (OmPP)™
IC Packages
Quik-Pak can provide virtually any IC package you need for your prototype devices, such as Open-molded Plastic Packages (OmPP)™, Open Cavity Plastic (OCPP), ceramic, laminate substrates and even custom package configurations.
If you don’t have a specific IC package identified, we can provide technical assistance to select the best package for your application.
IC Packaging Solutions
- Open-molded Plastic Packages (OmPP)™
- Open Cavity Plastic Packages
- Ceramic Packages
- Laminate Substrates
- Custom Package Configurations
Quik-Pak also provides complete Prototype Assembly Services, from Wafer Preparation to Die Bonding, Wire Bonding, Encapsulation, Flattening/Remolding and Marking/Branding.
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