Datasheets
Open-molded Plastic Package (OmPP)™ DatasheetOpen-molded Plastic Package (OmPP)™ Part Number Table
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Technical Article: Gaining Time and Creativity without Compromise
Quik-Pak Announces Copper Wire Bonding Capability
Quik-Pak Expands New Open-Molded Plastic Package (OmPP)™ Product family
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Open-molded Plastic Packages (OmPP)™
Air Cavity QFN Packages
Quik-Pak’s exclusive Open-molded Plastic Package (OmPP)™ is a pre-molded, air cavity QFN package (Quad Flat No-Lead) designed to provide a high quality, fast solution for your IC packaging and assembly needs.
These Open-molded Plastic Packages (OmPP)™ come in a variety of sizes and are ideal for prototype, mid volume or production volume applications.
- QFN Package with
Larger Die Paddle Area - Supports Larger Die and Ground Bonds Per Given QFN Body Size
- RoHS and REACH Compliant “Green” Molding Compound used to make QFN packages
- Gold Plated QFN Packages
- Superior Bondability
- Custom QFN Body Sizes and Lead Counts Available
OmPP™ Advantages
Pre-Molded Air Cavity Packages offer Flexibility
Quik-Pak’s Au/Ni plated QFN Packages are offered in a broad assortment of sizes from 3x3mm to 12x12mm with a variety of pitch options. They are manufactured using a RoHS and REACH compliant “green” molding compound and feature a larger die paddle area supporting larger die and ground bonds per given body size.Quik-Pak’s new OmPP™ air cavity packages are production quality and are available for rapid delivery to meet customers needs.
Open-molded Plastic Packages (OmPP)™ Part Numbers
Samples are available upon request. For information about OmPP™ contact Quik-Pak.
- Wafer Dicing
- Backgrinding
- Wire Bonding
- Complete Assembly
- Custom Packaging
- Patented Open Cavity Plastic Package (OCPP)
Custom OmPP™ Packages
Quik-Pak’s new line of Open-molded Plastic Packages (OmPP™) includes 28 open-tooled QFN packages meeting JEDEC foot prints for package bodies ranging from 3mm square to 12mm square. What if you like the size but want a custom I/O or paddle pattern? Quik-Pak can provide custom packages for low NRE charges.
For example, suppose you want a 3mm square DFN instead of one of our standard QFN’s. We can do it. Suppose you want to simulate package designs with high frequency transmission lines and then have someone build the package. We can do it. Quik-Pak is your source for microelectronic packaging and assembly solutions.
OmPP™ lids for our air cavity packages:
Quik-Pak offers matching lids for our new line of open cavity packages called OmPP™ (Open-molded Plastic Packages). Our standard flat lids are made from the same RoHS and REACH compliant plastic that we use to make our packages.
If you want to seal your packages, we can add a B-stage epoxy ring to the lid. Optional lid materials include glass, quartz, and alumina ceramic.Mid-volume assembly services:
Quik-Pak, well known for our quick-turn, prototype services, and assembly services for mid-volume production runs. Wirebonding capacity was recently expanded with the purchase of a K&S IConn wirebonder.
The expanded assembly capacity complements our new line of OmPP™ packages, which are especially well-suited to mid volume production in the leadframe (array) format.
Quik-Pak offers a complete turnkey assembly solution including:
