QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Laser Micromachining

Laser Micromachining
    Laser Micromachining 
Quik-Pak utilizes the ESI 5150 Laser Processing System to provide micromachining services for custom electronic packaging and a limitless range of other applications. This ultra-precision ND:YAG laser system cuts, shapes and marks just about any material including:
  • Plastics
  • Laminates
  • Composites
  • Glass
  • Ceramics
  • Silicon wafers
  • Metals, including copper and stainless steel

The laser micromachining system can be programmed to:
  • Drill microvias as small as 25µm in diameter
  • Cut grooves, steps, channels, slots or cavities
  • Scribe alphanumeric characters, logos or alignment features
  • Create precision polymeric or metallic stencils and masks
  • Rework and repair rigid and flex printed circuits
  • Trim, drill and dice MEMS devices
  • Remove solder mask to create precise pads on printed circuits or other components
  • Drill precision alignment holes

Quik-Pak can accommodate parts up to 21" x 25" x 0.75" thick and can accept drawing files in AutoCAD (.dxf or .dwg) and Gerber (.gbr) formats for processing.