QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Product Spotlight: Custom Molded QFN Packages

QFN Package - QFN24-4X5mm

Quik-Pak understands that the package is an integral part of the design process. Occasionally, the need arises for a specific footprint or lead count and a custom tooled package is the best option. That is why Quik-Pak offers custom molded QFN packages. These QFN packages can be tooled to meet the specific needs of your application.

Quik-Pak also offers a large assortment of Open-molded Plastic Packages (OmPP). These air cavity QFN and SOIC packages are designed to provide a high quality, fast solution for your IC packaging and assembly needs.

QFN Package - QFN36-10x10mm

Our offerings include:

  • A vast array of open tooled packages in stock that meet JEDEC standard outlines
  • Matching ceramic, plastic, and glass lids with epoxy seals are available
  • RoHS and REACH compliant "green" molding compound
  • Gold plated packages with superior bondability
  • Air cavity or encapsulation sealing options with assembly services

For more information regarding our custom molded QFN packages, contact our sales department.

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