QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Product Spotlight: Flip Chip

Quik-Pak Offers Flexible Flip Chip Assembly

Quik-Pak is a leading provider of Flip Chip Assembly Services for microelectronic device applications requiring a small footprint and short interconnects. Assembly applications include µBGA, 3D packaging, optoelectronic bonding and assembly, sensors, chip on glass, and more.

Quik-Pak offers:

Bonding:

  • Align to within 5m placement accuracy
  • Placement and bonding down to 100m pitch devices
  • Thermo-compression bonding of small gold-to-gold contacts (highest accuracy)
  • Thermosonic bonding of small gold-to-gold contacts (lower temperature)
  • Hot air solder reflow for Sn, SnPb, and other solders

Device Ball Bumping:

  • Solder ball bump to 305m (0.012") diameter on a 508m (0.020") pitch
  • 96C, 183C, and 217C alloys available

Device/Partial Wafer Stud Bumping:

  • Gold (Au) stud bumping of partial wafers and large die
  • Stud bumping pitch down to 150µm

Follow this link for for more information regarding Quik-Pak’s Flip Chip Assembly Services.

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