QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Product Spotlight: Open-molded Plastic Package (OmPP®)

Quik-Pak’s QFN OmPP Packages Improve Time-to-Market for Design Engineers

For design engineers that are required to validate the performance of their devices as quickly as possible, Quik-Pak’s OmPP packages(Open-mold Plastic Packages) provide a cost effective solution.

These production quality open molded QFN and SOIC packages are available in a variety of outlines and can be assembled with your device in 24 hours or less.

Some of the advantages of Quik-Pak’’s OmPP include:

  • RoHs and REACH Compliant “Green” Molding Compound
  • Gold Plated
  • Superior Bondability
  • Custom Body Sizes and Lead Counts Available

Quik-Pak offers a variety of lid and encapsulation options, or the package can be left open for device inspection, testing, micro-probing, etc.

For more information regarding Quik-Pak’s Open-molded Plastic Packages contact Quik-Pak at 1-858-674-4676 or moreinfo@icproto.com

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