QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Product Spotlight: Overmolded Packages

High Volume Plastic Overmolded Packages

Quik-Pak offers packaging and assembly for higher volume applications

  • Overmolded metal leadframe arrays
  • Saw singulated chip scale packages including QFN and DFN
  • Wire bonded devices
  • Flip chip devices

For more information regarding our overmolding capabilities, contact our sales department.

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