QuikPak - Wafer Preparation, Unlimited Packing Solutions, Custom Assembly Services

Product Spotlight: Stacked Die

Quik-Pak offers Stacked Die Assembly

Quik-Pak understands that today’s smaller, lighter technologies demand that you conserve real estate on the printed circuit board and simplify the board assembly process. A stacked die assembly delivers the smallest footprint and enables the integration of multiple components of varying function in a single assembly solution.

In addition to saving space, die stacking results in better electrical performance of the device, since the shorter routing of interconnections between circuits results in faster signal propagation and reduction in noise and cross-talk.

Quik-Pak’s unique ability to backgrind individual die enables the finished devices to meet original JEDEC package thickness specifications, and the company’s capabilities in Flip Chip, die attach and wire bonding, including die to die and die to substrate bonding, enable prototype assembly of your complicated stacked die devices.

Visit our Assembly Services page to learn more about Quik-Pak’s assembly solutions.

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